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  • 技術(shù)支持員英文簡歷

    時(shí)間:2024-07-03 11:40:28 英文簡歷范文 我要投稿
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    有關(guān)技術(shù)支持員英文簡歷范文

      minjun lu

    有關(guān)技術(shù)支持員英文簡歷范文

      curriculum vita

      room 1903, guangzhou zhou central sub-branch of the people's bank of china

      zhengzhou, henan, 50040 china

      @diyifanwe.com

      ducation

      20xx-09 ~ 20xx-06 jiangxi normal university the application of electronic technology technical school

      training

      20xx-09 ~ 20xx-09 asm technology shenzhen asm xtreme wire bonder training

      20xx-06 ~ 20xx-09 changan asat semiconductor assembly and test plant eagle 60 welding wire machine training asat(utac) certificate

      尋求電子方面的工作,特別是半導(dǎo)體行業(yè),芯片封裝企業(yè)。 2)尋求cob無塵車間camera modules(攝像頭模組)的wb機(jī)器相關(guān)工作。

      work experience

      (XX-05 ~ XX-04)

      company type: private enterprise company category: electrical,micro-electronics

      job title: equipment engineer positions: chief engineer

      job description: in the lite-on group under the silitek electronic (guangzhou) co., ltd., is responsible for the wb asm series and ks series welding machine machine and debugging in cob workshop, all kinds of problems and timely treatment machine in the production process, so that normal production. training assessment on line operator, assist manager to make work instruction, make improvement on various problems during production, and submit the proposals to improve the electronic file

      reason for leaving: come home to development

      project experience

      changan asat semiconductor assembly and test plant (XX-06 ~ XX-10)

      job title: equipment technician

      project description: XX5 june to XX november in changan asat semiconductor assembly and test plant (now call utac) for more than five years, the factory for chip packaging enterprises, long-term production of various packaging chips, such as fpbga tpga ebga lpcc tapp qfp. i plant welding line department (wire bond) do technician team leader, has more than five years of chip manufacturing working experience, familiar with the former process and packaging technology, understand the chip manufacturing process. job five years through long-term of study and practice has a weld line solid theoretical foundation and rich practical experience, proficient in welding line chip machine (especially asm eagle60), can solve various problems of machine in the production process. there are multiple lines, long lines, super low line, multiple grains, some grains multilayer die, multilayer welding and bsob welding wires problem as well as a variety of production process of difficult miscellaneous diseases. proficient in olp production. for the machine maintenance, repair and maintenance of i also very familiar with, for the repair and maintenance of production equipment have many years of work experience. i also line technician leader, responsible for the long-term production management area, grass-roots staff management capability of the production line

      responsibility: asm wire bonder related work

      special skills

      professional title:

      computer level: national computer exam. grade 3

      computer skills:

      strengths: eight years wire bonding working experience, familiar with the asm and kns series wire bonders

      language skills

      chinese: good cantonese: good

      english level: spoken general

      english: general

      career objective

      career direction: wire bonding machine related work

      self info.

      self assessment:

      for people: honest, generous, warm and cheerful

      work: diligent, good cooperation, rigorous style of work

      strong adaptability and self-learning ability,

      strong management, organizational ability

      hobbies: surf the internet,play games,listen to the music,sports

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